Wafer Processing Equipment by SemiTEq include 3 basic product lines:

• Physical Vapour Deposition Systems  (PVD Systems) for high-quality thin-film compositions: e-Beam and magnetron sputtering in UHV
• Plasma Etching (PE) Systems and Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems: processes of plasma-chemical etching and deposition of dielectric (SiNx, SiO₂ , etc.) in a combined capacitive and inductive plasma discharge
• Rapid Thermal Annealing and Rapid Thermal Processing systems (RTA & RTP Systems): rapid thermal annealing and processing of semiconductor wafers in inert atmosphere and in controlled gas, oxygen or other non-toxic atmosphere

Final product: key processes for precision deposition and etching of metal and dielectric thin films to create a barrier, insulating layers, and other semiconductor devices, as well as for other applications (deposition, etching, sputtering).